Technology companies and projects

Explore technology companies across software and IT services, telecommunications, electronics, semiconductors and networking. Browse the projects in each industry and follow the authors of the evaluations available on Orbitrum.

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1,178 projects

China Strategic TechPublic market company profile.Web2

China Wafer Level CSPChina Wafer Level CSP Co., Ltd., together with its subsidiaries, creates, develops, manufactures, and sells semiconductor, interconnect, and imaging technologies in China and internationally. The company offers image sensor, biometric identification, and ambient light sensor chips; medical electronic devices; and manufacturing services of TSV and 3DIC technology. It also provides design, test, and logistics solutions, including design chain management; design for manufacturing; design for cost; full design and verification of WL, lead frame, laminate, etc.; electrical, thermal, and mechanical characterization; and quick turn prototype services, as well as packaging and testing services. In addition, the company offers assembly services, such as turnkey solutions for TSV, wire bond, and flip chip; high-volume manufacturing; wafer finishing and 2/3D assembly; wafer to wafer and die to wafer bonding; micro-joining; integrated and SMT passives, as well as FA and reliability testing services comprising package and board level, bump reliability, underfill/EMC adhesion, drop and bend tests, solder joint reliability prediction, materials lab, and failure analysis. Further, it engages in research and development; patent management; field application promotion; investment management; and technology development activities. It exports its products. The company serves mobile handset manufacturers and semiconductor chip design houses. China Wafer Level CSP Co., Ltd. was founded in 2005 and is headquartered in Suzhou, China.Web2

Chip HopePublic market company profile.Web2

Chipbond TechChipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of driver IC and non-driver IC packaging and testing services in Taiwan and internationally. The company offers back and front side metallization processing services; bumping manufacturing services, including gold, solder, and copper bumping services; redistribution layer services; test services; and die processing services, such as wafer grinding/thinning, dicing, and tape-and-reel processes, as well as chip-on-film, chip on glass, chip-on-plastic, packaging attachment, and wafer level chip scale packaging services. It also provides compound semiconductors including SiGe, GaAs, GaN, SiC, and other wafers; flexible tape-and-reel circuit substrate; and chip tray. In addition, it develops, manufactures, packages, tests, sells, and after-sale services of integrated circuit and special materials for semiconductors; invests in, develops, manufactures, and sells electronic components; and manufactures and sales elements. Chipbond Technology Corporation was incorporated in 1997 and is based in Hsinchu City, Taiwan.Web2

ChipMOSChipMOS TECHNOLOGIES INC. engages in the research and development, manufacture, and sale of integrated circuits, and related assembly and testing services in Taiwan, Japan, the People’s Republic of China, and internationally. It operates through five segments: Testing; Assembly; Display Panel Driver Semiconductor Assembly and Testing; Bumping; and Others. The company offers leadframe-based packages, such as the small outline package, thin small outline package, and quad flat package; and substrate-based packages, including FBGA, VFBGA, stacked chip-scale package, TFBGA, LGA, COG, and COF; and testing solutions comprising professional wafer and final testing, tester/tooling correlation, test program verification, engineering lot and pilot lot run arrangement, engineering support, device failure mode analysis, and automation system for simple digital logic, complex ASIC, high speed digital, memory, and mixed signal and display driver IC devices. It also provides bumping services; intellectual property management and enabling technologies; and turnkey services, such as wafer bumping/RDL, wafer sort, assembly, final test, and drop shipment to display driver IC, memory IC, and logic mixed-signal IC. The company serves fabless companies, integrated device manufacturers, and foundries. ChipMOS TECHNOLOGIES INC. was incorporated in 1997 and is headquartered in Hsinchu City, Taiwan.Web2

ChipMOS TechChipMOS TECHNOLOGIES INC. engages in the research and development, manufacture, and sale of integrated circuits, and related assembly and testing services in Taiwan, Japan, the People’s Republic of China, and internationally. It operates through five segments: Testing; Assembly; Display Panel Driver Semiconductor Assembly and Testing; Bumping; and Others. The company offers leadframe-based packages, such as the small outline package, thin small outline package, and quad flat package; and substrate-based packages, including FBGA, VFBGA, stacked chip-scale package, TFBGA, LGA, COG, and COF; and testing solutions comprising professional wafer and final testing, tester/tooling correlation, test program verification, engineering lot and pilot lot run arrangement, engineering support, device failure mode analysis, and automation system for simple digital logic, complex ASIC, high speed digital, memory, and mixed signal and display driver IC devices. It also provides bumping services; intellectual property management and enabling technologies; and turnkey services, such as wafer bumping/RDL, wafer sort, assembly, final test, and drop shipment to display driver IC, memory IC, and logic mixed-signal IC. The company serves fabless companies, integrated device manufacturers, and foundries. ChipMOS TECHNOLOGIES INC. was incorporated in 1997 and is headquartered in Hsinchu City, Taiwan.Web2

Chips&MediaPublic market company profile.Web2

Chipsea Technologies ShenzhenPublic market company profile.Web2

Chongqing Genori TechChongqing Genori Technology Co., Ltd. manufactures core components and materials. Its products include silicon, quartz, silicon carbide, and aluminum oxide ceramic equipment parts used in semiconductor etching and vapor deposition processes. It also provides surface treatments like spray regeneration, anodization, and precision cleaning for vacuum components. The company caters to integrated circuit and display panel manufacturing sectors. The company was founded in 2016 and is based in Chongqing, China.Web2

Chunghwa Precision TestChunghwa Precision Test Tech. Co., Ltd., together with its subsidiaries, engages in the testing of semiconductor components in Taiwan, Republic of China, and internationally. The company is involved in the design, processing, assembly, production, and sale of printed circuit boards and related consultation services; and markets electronic products. It also offers probe cards for use in wafer testing, as well as to examine wafer yields after production; load boards that are interface for yield testing after IC packaging during the back-end process of semiconductor manufacturing; and probing needles, which transmit signals to the substrate and the probe cards. In addition, the company maintains and sells electronic parts and machinery processed products; invests in, retails, and wholesales electronic materials; investment activities; manufacture and retail of intellectual equipment, software and hardware system combination of intellectual factory and technology consulting services. Chunghwa Precision Test Tech. Co., Ltd. was incorporated in 2005 and is based in Taoyuan City, Taiwan.Web2

Chutian Dragon CoPublic market company profile.Web2

Cicor Technologies LtdPublic market company profile.Web2

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About this sector

This sector follows the Technology industries used in the application. Its scope includes software services, communications, devices, electronic components, chips, financial technology infrastructure and integrated hardware or software. The categories help separate business roles that a broad technology label would otherwise combine.

How to compare projects

An IT service provider, a hardware supplier and a network operator can require different research questions. Use the industry label and profile description to establish that role, then read the available author commentary in context.

Projects follow the categories assigned in the Orbitrum application. This collection supports research and discovery; it is not an investment ranking.

Industry definitions

Software & IT Services (3,649)

Software businesses and information-technology service providers.

Telecommunications Services (480)

Companies providing telecommunications services.

Computers, Phones & Household Electronics (519)

Companies supplying computers, phones or household electronics.

Electronic Equipment & Parts (785)

Suppliers of electronic equipment and components.

Semiconductors & Semiconductor Equipment (1,178)

Chip companies and semiconductor-equipment suppliers within Technology.

Communications & Networking (475)

Projects providing communications or networking technology.

Financial Technology (Fintech) & Infrastructure (324)

Companies providing financial technology or supporting infrastructure.

Integrated Hardware & Software (102)

Businesses combining hardware and software in their products or services.

Office Equipment (81)

Companies supplying office equipment.

Questions to guide your research

Is the project primarily a product, a service or infrastructure?
Which users, customers or operating dependencies does the research identify?
What differentiates the project from others in the same industry?

Questions about this sector

Where can I browse semiconductor companies?

Semiconductors & Semiconductor Equipment is an industry in this Technology sector. The application also uses that industry label under Technology / AI; each page shows the profiles assigned to its own category.

Where can I find software and cloud businesses?

Software & IT Services is an industry here. Software, Cloud & Data Infrastructure appears separately under Technology / AI. Use the recorded categories and project descriptions to locate the type of business you want to research.